A calorimetric study of precipitation in commercial aluminium alloy 6061 I Dutta, SM Allen
Journal of materials science letters 10 (6), 323-326, 1991
489 1991 Effect of reinforcement on the aging response of cast 6061 Al-Al2 O3 particulate composites I Dutta, SM Allen, JL Hafley
Metallurgical Transactions A 22, 2553-2563, 1991
229 1991 A theoretical and experimental study of aluminum alloy 6061-SiC metal matrix composite to identify the operative mechanism for accelerated aging I Dutta, DL Bourell
Materials Science and Engineering: A 112, 67-77, 1989
187 1989 A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report I Dutta
Journal of Electronic Materials 32, 201-207, 2003
167 2003 Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders I Dutta, D Pan, RA Marks, SG Jadhav
Materials Science and Engineering: A 410, 48-52, 2005
162 2005 Influence of dislocation density and distribution on the aging behavior of 6061 AlSiCw composites I Dutta, DL Bourell
Acta Metallurgica et Materialia 38 (11), 2041-2049, 1990
150 1990 Impression creep characterization of rapidly cooled Sn–3.5 Ag solders I Dutta, C Park, S Choi
Materials Science and Engineering: A 379 (1-2), 401-410, 2004
137 2004 Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties I Dutta, P Kumar, G Subbarayan
Jom 61, 29-38, 2009
119 2009 Interfacial effects during thermal cycling of Cu-filled through-silicon vias (TSV) P Kumar, I Dutta, MS Bakir
Journal of electronic materials 41, 322-335, 2012
108 2012 Role of Al2 O3 particulate reinforcements on precipitation in 2014 Al-matrix composites I Dutta, CP Harper, G Dutta
Metallurgical and Materials transactions A 25, 1591-1602, 1994
103 1994 An analytical study of residual stress effects on uniaxial deformation of whisker reinforced metal-matrix composites I Dutta, JD Sims, DM Seigenthaler
Acta metallurgica et materialia 41 (3), 885-908, 1993
82 1993 Role of interfacial and matrix creep during thermal cycling of continuous fiber reinforced metal–matrix composites I Dutta
Acta materialia 48 (5), 1055-1074, 2000
72 2000 A theoretical investigation of accelerated aging in metal-matrix composites I Dutta, DL Bourell, D Latimer
Journal of Composite Materials 22 (9), 829-849, 1988
65 1988 Creep behavior of interfaces in fiber reinforced metal–matrix composites JV Funn, I Dutta
Acta materialia 47 (1), 149-164, 1998
62 1998 Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011
61 2011 Texture development and strain hysteresis in a NiTi shape-memory alloy during thermal cycling under load B Ye, BS Majumdar, I Dutta
Acta Materialia 57 (8), 2403-2417, 2009
60 2009 Underfill constraint effects during thermomechanical cycling of flip-chip solder joints I Dutta, A Gopinath, C Marshall
Journal of Electronic Materials 31, 253-264, 2002
60 2002 Effect of Ag and Cu concentrations on the creep behavior of Sn-based solders T Chen, I Dutta
Journal of electronic materials 37, 347-354, 2008
58 2008 Deformation behavior of Sn-3.8 Ag-0.7 Cu solder at intermediate strain rates: Effect of microstructure and test conditions X Long, I Dutta, V Sarihan, DR Frear
Journal of Electronic Materials 37, 189-200, 2008
56 2008 Kinetic evidence for the structural similarity between a supercooled liquid and an icosahedral phase in bulk metallic glass MW Chen, I Dutta, T Zhang, A Inoue, T Sakurai
Applied Physics Letters 79 (1), 42-44, 2001
54 2001