| Grafting polymers on surfaces: A new powerful and versatile diazonium salt-based one-step process in aqueous media V Mévellec, S Roussel, L Tessier, J Chancolon, M Mayne-LʼHermite, ... Chemistry of Materials 19 (25), 6323-6330, 2007 | 254 | 2007 |
| Surfactant‐stabilized aqueous iridium (0) colloidal suspension: an efficient reusable catalyst for hydrogenation of arenes in biphasic media V Mévellec, A Roucoux, E Ramirez, K Philippot, B Chaudret Advanced Synthesis & Catalysis 346 (1), 72-76, 2004 | 142 | 2004 |
| A simple and reproducible method for the synthesis of silica-supported rhodium nanoparticles and their investigation in the hydrogenation of aromatic compounds V Mévellec, A Nowicki, A Roucoux, C Dujardin, P Granger, E Payen, ... New Journal of Chemistry 30 (8), 1214-1219, 2006 | 93 | 2006 |
| Enantioselective hydrogenation of ethyl pyruvate in biphasic liquid–liquid media by reusable surfactant-stabilized aqueous suspensions of platinum nanoparticles V Mévellec, C Mattioda, J Schulz, JP Rolland, A Roucoux Journal of catalysis 225 (1), 1-6, 2004 | 50 | 2004 |
| Nanoheterogeneous catalytic hydrogenation of N-, O-or S-heteroaromatic compounds by re-usable aqueous colloidal suspensions of rhodium (0) V Mévellec, A Roucoux Inorganica chimica acta 357 (10), 3099-3103, 2004 | 49 | 2004 |
| Organic phase stabilization of rhodium nanoparticle catalyst by direct phase transfer from aqueous solution to room temperature ionic liquid based on surfactant counter anion … V Mévellec, B Leger, M Mauduit, A Roucoux Chemical communications, 2838-2839, 2005 | 29 | 2005 |
| Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit V Mevellec, S Roussel, S Palacin, G Deniau, T Berthelot, C Baudin, ... US Patent 9,725,602, 2017 | 17 | 2017 |
| Method for preparing an organic film at the surface of solid support under non-electrochemical conditions, solid support thus obtained and preparation kit V Mevellec, S Roussel, S Palacin, G Deniau US Patent 8,709,542, 2014 | 13 | 2014 |
| Wet-process deposition of TSV liner and metal films C Truzzi, F Raynal, V Mevellec 2009 IEEE International Conference on 3D System Integration, 1-6, 2009 | 13 | 2009 |
| Electrolyte and process for electroplating copper onto a barrier layer V Mevellec, S Dominique, L Religieux US Patent 10,472,726, 2019 | 10 | 2019 |
| Method of preparing an electrically insulating film and application for the metallization of vias V Mevellec, J Gonzalez, S Dominique US Patent 8,119,542, 2012 | 7 | 2012 |
| Localized grafting through chemical lift-off A Mesnage, G Deniau, L Tessier, V Mévellec, S Palacin Applied surface science 257 (17), 7805-7812, 2011 | 7 | 2011 |
| Electrografted copper seed layer for high aspect ratio TSVs interposer metallization F Gaillard, L Religieux, T Mourier, C Ribière, L Vandroux, D Suhr, ... ECS transactions 64 (40), 9, 2015 | 6 | 2015 |
| Solution and method for activating the oxidized surface of a semiconductor substrate V Mevellec, S Dominique US Patent 8,883,641, 2014 | 6 | 2014 |
| Electrografted insulator layer as copper diffusion barrier for TSV interposers V Mevellec, D Suhr, T Dequivre, F Raynal Additional Papers and Presentations 2013 (DPC), 001051-001084, 2013 | 4 | 2013 |
| Integration of Electrografted Layers for the Metallization of Deep TSVs F Raynal, V Mevellec, N Frederich, D Suhr, I Bispo, B Couturier, C Truzzi Journal of microelectronics and electronic packaging 7 (3), 119-124, 2010 | 4 | 2010 |
| Mesoporous silica encapsulating Rh (0) colloids: structure and catalytic properties R Mouawia, M Boutros, F Launay, V Semmer-Herlédan, A Gédéon, ... Studies in Surface Science and Catalysis 158, 1573-1580, 2005 | 4 | 2005 |
| Full 300 mm electrical characterization of 3d integration using high aspect ratio (10: 1) mid-process through silicon vias F Gaillard, T Mourier, L Religieux, D Bouchu, C Ribiere, S Minoret, ... 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-6, 2015 | 3 | 2015 |
| Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method V Mevellec US Patent 8,524,512, 2013 | 3 | 2013 |
| A novel bottom up fill mechanism for the metallization of advanced node copper interconnects V Mevellec, M Thiam, D Suhr, L Religieux, P Blondeau, JB Chaumont, ... ECS Transactions 75 (7), 9, 2016 | 2 | 2016 |
Pascal VielIngénieur - Chercheur, Commissariat à l'Energie AtomiqueVerified email at cea.fr
Pascal VielIngénieur - Chercheur, Commissariat à l'Energie AtomiqueVerified email at cea.fr