| Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods SK Groothuis, J Li, H Zhang, PA Silvestri, X Li, S Luo, LG England, ... US Patent 9,153,520, 2015 | 107 | 2015 |
| A predictive model for IC self-heating based on effective medium and image charge theories and its implications for interconnect and transistor reliability W Ahn, H Zhang, T Shen, C Christiansen, P Justison, S Shin, MA Alam IEEE Transactions on Electron Devices 64 (9), 3555-3562, 2017 | 28 | 2017 |
| Temperature dependency of coefficient of hygroscopic swelling of molding compound S Park, H Zhang, X Zhang, SL Ng, HC Lee 2009 59th Electronic Components and Technology Conference, 172-179, 2009 | 27 | 2009 |
| A flexible approach to finding representative pattern sets G Liu, H Zhang, L Wong IEEE Transactions on Knowledge and Data Engineering 26 (7), 1562-1574, 2013 | 25 | 2013 |
| Effect of metal line width on electromigration of BEOL Cu interconnects S Choi, C Christiansen, L Cao, J Zhang, R Filippi, T Shen, KB Yeap, ... 2018 IEEE International Reliability Physics Symposium (IRPS), 4F. 4-1-4F. 4-6, 2018 | 23 | 2018 |
| New analytical equations for skin and proximity effects in interconnects operated at high frequency H Zhang, JH Lee, NM Iyer, L Cao 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM), 39-41, 2017 | 16 | 2017 |
| Influence of stress induced CT local layout effect (LLE) on 14nm FinFET P Zhao, SM Pandey, E Banghart, X He, R Asra, V Mahajan, H Zhang, ... 2017 Symposium on VLSI Technology, T228-T229, 2017 | 14 | 2017 |
| Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods SK Groothuis, J Li, H Zhang, PA Silvestri, X Li, S Luo, LG England, ... US Patent 10,170,389, 2019 | 11 | 2019 |
| Hygroscopic swelling behavior of molding compound at high temperature H Zhang, S Park, S Hong 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 11 | 2010 |
| Supporting exploratory hypothesis testing and analysis G Liu, H Zhang, M Feng, L Wong, SK Ng ACM Transactions on Knowledge Discovery from Data (TKDD) 9 (4), 1-24, 2015 | 10 | 2015 |
| Understanding and improving reliability for wafer level chip scale package: A study based on 45nm RFSOI technology for 5G applications ZJ Wu, H Zhang, J Malinowski IEEE Journal of the Electron Devices Society 8, 1305-1314, 2020 | 9 | 2020 |
| Die edge crack propagation modeling for risk assessment of advanced technology nodes T Xu, ZJ Wu, H Zhang, C Graas, P Justison 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2260-2266, 2018 | 8 | 2018 |
| Influence of skin effect on the current distribution of grounded-gate NMOS device JH Lee, NM Iyer, H Zhang IEEE Electron Device Letters 38 (11), 1583-1585, 2017 | 8 | 2017 |
| Impact of 3D Via Middle TSV process on 20nm Wafer level FEOL and BEOL reliability CS Premachandran, L England, S Kannan, R Ranjan, KB Yeap, W Teo, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1593-1598, 2016 | 8 | 2016 |
| Optimization of TSV interconnects and BEOL layers under annealing process through fracture evaluation F Qin, M Zhang, Y Dai, P Chen, T An, H He, H Zhang, J Zheng Fatigue & Fracture of Engineering Materials & Structures 43 (7), 1433-1445, 2020 | 6 | 2020 |
| 45RFSOI WLCSP board level package risk assessment and solder joint reliability performance improvement H Zhang, ZJ Wu, J Malinowski, M Carino, K Young-Fisher, J Trewhella, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2151-2156, 2020 | 6 | 2020 |
| Physics of SOA degradation phenomena in power transistors under ESD conditions JH Lee, NM Iyer, H Zhang, M Prabhu, PC Li, G Zhang, TC Tsai 2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 1-9, 2016 | 6 | 2016 |
| Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages H Zhang State University of New York at Binghamton, 2011 | 4 | 2011 |
| Investigation of hygroscopic swelling of polymers in freezing temperature S Park, H Zhang ASME International Mechanical Engineering Congress and Exposition 42991, 281-285, 2007 | 4 | 2007 |
| A Closed-Form Transient Joule Heating Model for an Interconnect in an Integrated Circuit W Ahn, H Zhang, T Shen, P Justison, MA Alam IEEE Electron Device Letters 41 (2), 288-291, 2019 | 2 | 2019 |
