| The 2021 magnonics roadmap A Barman, G Gubbiotti, S Ladak, AO Adeyeye, M Krawczyk, J Gräfe, ... Journal of Physics: Condensed Matter 33 (41), 413001, 2021 | 611 | 2021 |
| Compact physical models for multiwall carbon-nanotube interconnects A Naeemi, JD Meindl IEEE Electron Device Letters 27 (5), 338-340, 2006 | 400 | 2006 |
| Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI) A Naeemi, R Sarvari, JD Meindl IEEE Electron Device Letters 26 (2), 84-86, 2005 | 398 | 2005 |
| Conductance modeling for graphene nanoribbon (GNR) interconnects A Naeemi, JD Meindl IEEE electron device letters 28 (5), 428-431, 2007 | 320 | 2007 |
| Design and performance modeling for single-walled carbon nanotubes as local, semiglobal, and global interconnects in gigascale integrated systems A Naeemi, JD Meindl IEEE Transactions on Electron Devices 54 (1), 26-37, 2006 | 304 | 2006 |
| Compact physics-based circuit models for graphene nanoribbon interconnects A Naeemi, JD Meindl IEEE Transactions on Electron Devices 56 (9), 1822-1833, 2009 | 291 | 2009 |
| Physical modeling of temperature coefficient of resistance for single-and multi-wall carbon nanotube interconnects A Naeemi, JD Meindl IEEE Electron Device Letters 28 (2), 135-138, 2007 | 194 | 2007 |
| Performance modeling for single-and multiwall carbon nanotubes as signal and power interconnects in gigascale systems A Naeemi, JD Meindl IEEE transactions on electron devices 55 (10), 2574-2582, 2008 | 187 | 2008 |
| Carbon nanotube interconnects A Naeemi, JD Meindl Proceedings of the 2007 international symposium on Physical design, 77-84, 2007 | 175 | 2007 |
| Power delivery for 3D chip stacks: Physical modeling and design implication G Huang, M Bakir, A Naeemi, H Chen, JD Meindl 2007 IEEE Electrical Performance of Electronic Packaging, 205-208, 2007 | 157 | 2007 |
| Evaluation of the potential performance of graphene nanoribbons as on-chip interconnects S Rakheja, V Kumar, A Naeemi Proceedings of the IEEE 101 (7), 1740-1765, 2013 | 156 | 2013 |
| 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation MS Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ... 2008 IEEE Custom Integrated Circuits Conference, 663-670, 2008 | 140 | 2008 |
| Performance and energy-per-bit modeling of multilayer graphene nanoribbon conductors V Kumar, S Rakheja, A Naeemi IEEE transactions on electron devices 59 (10), 2753-2761, 2012 | 112 | 2012 |
| Monolayer metallic nanotube interconnects: Promising candidates for short local interconnects A Naeemi, JD Meindl IEEE Electron Device Letters 26 (8), 544-546, 2005 | 111 | 2005 |
| Performance benchmarking for graphene nanoribbon, carbon nanotube, and Cu interconnects A Naeemi, JD Meindl 2008 International Interconnect Technology Conference, 183-185, 2008 | 108 | 2008 |
| Cu interconnect limitations and opportunities for SWNT interconnects at the end of the roadmap A Ceyhan, A Naeemi IEEE Transactions on Electron Devices 60 (1), 374-382, 2012 | 104 | 2012 |
| Non-volatile clocked spin wave interconnect for beyond-CMOS nanomagnet pipelines S Dutta, SC Chang, N Kani, DE Nikonov, S Manipatruni, IA Young, ... Scientific reports 5 (1), 9861, 2015 | 95 | 2015 |
| Quantum games and interactive tools for quantum technologies outreach and education ZC Seskir, P Migdał, C Weidner, A Anupam, N Case, N Davis, C Decaroli, ... Optical Engineering 61 (8), 081809-081809, 2022 | 72 | 2022 |
| Impact of electron-phonon scattering on the performance of carbon nanotube interconnects for GSI A Naeemi, JD Meindl IEEE Electron Device Letters 26 (7), 476-478, 2005 | 69 | 2005 |
| Optimal global interconnects for GSI A Naeemi, R Venkatesan, JD Meindl IEEE Transactions on Electron Devices 50 (4), 980-987, 2003 | 62 | 2003 |
Chenyun PanAssistant Professor of EE, University of Texas at ArlingtonBestätigte E-Mail-Adresse bei uta.edu
