Folgen
Ding-Ming Kwai 蒯定明
Ding-Ming Kwai 蒯定明
Hon Young Semiconductor
Bestätigte E-Mail-Adresse bei hys.com.tw
Titel
Zitiert von
Zitiert von
Jahr
On-chip TSV testing for 3D IC before bonding using sense amplification
PY Chen, CW Wu, DM Kwai
2009 Asian Test Symposium, 450-455, 2009
1762009
On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding
PY Chen, CW Wu, DM Kwai
2010 28th VLSI Test Symposium (VTS), 263-268, 2010
1512010
A unified formulation of honeycomb and diamond networks
B Parhami, DM Kwai
IEEE Transactions on Parallel and Distributed Systems 12 (1), 74-80, 2001
922001
A built-in self-test scheme for the post-bond test of TSVs in 3D ICs
YJ Huang, JF Li, JJ Chen, DM Kwai, YF Chou, CW Wu
29th VLSI test symposium, 20-25, 2011
902011
Performance characterization of TSV in 3D IC via sensitivity analysis
JW You, SY Huang, DM Kwai, YF Chou, CW Wu
2010 19th IEEE Asian Test Symposium, 389-394, 2010
792010
Small delay testing for TSVs in 3-D ICs
SY Huang, YH Lin, KH Tsai, WT Cheng, S Sunter, YF Chou, DM Kwai
Proceedings of the 49th Annual Design Automation Conference, 1031-1036, 2012
732012
Image capture device
CW Wu, DM Kwai, J Li, KY Yeh
US Patent App. 12/977,495, 2012
682012
Method for testing through-silicon-via and the circuit thereof
CW Wu, PY Chen, DM Kwai, YF Chou
US Patent 8,531,199, 2013
462013
Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization
CL Lung, YL Ho, DM Kwai, SC Chang
2011 Design, Automation & Test in Europe, 1-6, 2011
442011
Practical considerations in applying/spl Sigma/-/spl Delta/modulation-based analog BIST to sampled-data systems
HC Hong, JL Huang, KT Cheng, CW Wu, DM Kwai
IEEE Transactions on Circuits and Systems II: Analog and Digital Signal …, 2003
422003
Parametric delay test of post-bond through-silicon vias in 3-D ICs via variable output thresholding analysis
YH Lin, SY Huang, KH Tsai, WT Cheng, S Sunter, YF Chou, DM Kwai
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013
412013
In-situ method for TSV delay testing and characterization using input sensitivity analysis
JW You, SY Huang, YH Lin, MH Tsai, DM Kwai, YF Chou, CW Wu
IEEE transactions on very large scale integration (VLSI) systems 21 (3), 443-453, 2012
392012
Detection of SRAM cell stability by lowering array supply voltage
DM Kwai, HW Chang, HJ Liao, CH Chiao, YF Chou
Proceedings of the Ninth Asian Test Symposium, 268-273, 2000
392000
A test integration methodology for 3D integrated circuits
CW Chou, JF Li, JJ Chen, DM Kwai, YF Chou, CW Wu
2010 19th IEEE Asian Test Symposium, 377-382, 2010
372010
Method for testing through-silicon-via and the circuit thereof
CW WU, PY Chen, DM Kwai, YF Chou
US Patent App. 12/572,030, 2011
342011
Periodically regular chordal rings
B Parhami, DM Kwai
IEEE Transactions on parallel and Distributed Systems 10 (6), 658-672, 1999
341999
Data-driven control scheme for linear arrays: application to a stable insertion sorter
B Parhami, DM Kwai
IEEE Transactions on Parallel and Distributed Systems 10 (1), 23-28, 1999
331999
Stacked structure and stacked method for three-dimensional chip
YF Chou, DM Kwai
US Patent 8,710,676, 2014
322014
Electrostatic discharge protection scheme for semiconductor device stacking process
ZW Jiang, DM Kwai, SH Chen
US Patent App. 12/851,539, 2011
262011
Yield enhancement by bad-die recycling and stacking with though-silicon vias
YF Chou, DM Kwai, CW Wu
IEEE transactions on very large scale integration (VLSI) systems 19 (8 …, 2010
262010
Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.
Artikel 1–20