Get my own profile
Public access
View all3 articles
4 articles
available
not available
Based on funding mandates
Co-authors
- Udayan GangulyProfessor, Electrical Engineering, IIT BombayVerified email at ee.iitb.ac.in
- Saurabh LodhaProfessor, Electrical Engineering, IIT BombayVerified email at ee.iitb.ac.in
- Aneesh NainaniStanford Univeristy, Applied MaterialsVerified email at stanford.edu
- Ashish PalDevice & Process Simulation Engineer, Applied MaterialsVerified email at amat.com
- Shashank GuptaPhD student, Stanford UniversityVerified email at stanford.edu
- Mehdi SaremiResearcherVerified email at asu.edu
- Punyashloka DebashisComponents Research, Intel Corp.Verified email at intel.com
- Gaurav TharejaApplied Materials, Intel, Stanford University, Texas Instruments, ST MicroelectronicsVerified email at stanfordalumni.org
- Sanjay NatarajanProfessor, Portland State UniversityVerified email at pdx.edu
- Toshihiko MiyashitaMicron Technology Inc.Verified email at micron.com
- He RenApplied Materials, IncVerified email at amat.com
- Apurba LahaProfessor, Department of Electrical Engineering, Indian Institute of Technology BombayVerified email at ee.iitb.ac.in
- Sangya DuttaPhD Student, Dept. of Electrical Engineering, IIT BombayVerified email at ee.iitb.ac.in
- Nam Sung KimSenior Director, Applied MaterialsVerified email at amat.com
- Michael HavertyApplied Materials, NextMol, Property Vectors, Exabyte, Intel CorporationVerified email at stanfordalumni.org
- C. ThomidisVerified email at bu.edu