| A Calderón preconditioner for high dielectric contrast media M Gossye, M Huynen, DV Ginste, D De Zutter, H Rogier IEEE Transactions on Antennas and Propagation 66 (2), 808-818, 2017 | 33 | 2017 |
| Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects M Huynen, KY Kapusuz, X Sun, G Van der Plas, E Beyne, D De Zutter, ... IEEE Transactions on Microwave Theory and Techniques 68 (4), 1217-1233, 2020 | 24 | 2020 |
| A 3-D differential surface admittance operator for lossy dipole antenna analysis M Huynen, M Gossye, D De Zutter, DV Ginste IEEE Antennas and Wireless Propagation Letters 16, 1052-1055, 2016 | 21 | 2016 |
| Rigorous Full-Wave Resistance and Inductance Computation of 3-D Interconnects M Huynen, D De Zutter, DV Ginste IEEE Microwave and Wireless Components Letters 28 (6), 455-457, 2018 | 15 | 2018 |
| Broadband 3-D boundary integral equation characterization of composite conductors M Huynen, D De Zutter, DV Ginste 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 8 | 2019 |
| A 2-D differential surface admittance operator for combined magnetic and dielectric contrast D Bosman, M Huynen, D De Zutter, H Rogier, DV Ginste Computers & Mathematics with Applications 102, 175-186, 2021 | 5 | 2021 |
| Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method D Bosman, M Huynen, D De Zutter, X Sun, N Pantano, G Van der Plas, ... 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | 4 | 2022 |
| Broadband full-wave BIE impedance characterization of 3-D interconnects M Huynen, D DeZutter, DV Ginste 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 3 | 2018 |
| Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies D Bosman, M Huynen, D De Zutter, X Sun, N Pantano, G Van der Plas, ... IEEE Transactions on Microwave Theory and Techniques, 2023 | 2 | 2023 |
| Construction of the differential surface admittance operator with an extended Fokas method for electromagnetic scattering at polygonal objects with arbitrary material parameters D Bosman, M Huynen, D De Zutter, DV Ginste Computers & Mathematics with Applications 128, 44-54, 2022 | 2 | 2022 |
| A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects M Huynen, D De Zutter, DV Ginste 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), 1-4, 2018 | 2 | 2018 |
| (Why do we need) Wireless Heterogeneous Integration (anyway?) M Peeters, S Sinha, X Sun, C Desset, G Gramegna, J Slabbekoorn, P Bex, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | 1 | 2022 |
| Analysis of the Influence of Roughness on the Propagation Constant of a Waveguide via Two Sparse Stochastic Methods R Waeytens, D Bosman, M Huynen, M Gossye, H Rogier, DV Ginste 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 1 | 2020 |
| An Enhanced Differential Surface Admittance Operator for the Signal Integrity Modeling of Interconnects M Huynen, KY Kapusuz, D De Zutter, DV Ginste 2019 International Conference on Electromagnetics in Advanced Applications …, 2019 | 1 | 2019 |
| Boundary integral equation study of the influence of finite conductivity on antenna radiation using a 3-D differential surface admittance operator M Huynen, D De Zutter, DV Ginste 2017 International Applied Computational Electromagnetics Society Symposium …, 2017 | 1 | 2017 |
| Accurate Characterization of Radiation from Interconnects on Interposer at mmWave Frequencies M Huynen, D Bosman, A Moerman, DV Ginste 2022 IEEE 26th Workshop on Signal and Power Integrity (SPI), 1-4, 2022 | | 2022 |
| Comparison of Two Novel Integral Equation Approaches for Lossy Conductor Modeling M Huynen, M Gossye, D De Zutter, H Rogier, DV Ginste 2021 International Conference on Electromagnetics in Advanced Applications …, 2021 | | 2021 |
| Reduction of Common-Mode Noise in Bent Differential Interconnects for PAM4 Signaling A Deroo, M Huynen, H Rogier, Q Van den Brande, DV Ginste, HW Chan, ... 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2019 | | 2019 |
| Een driedimensionale differenti le oppervlakte-admittantie-operator voor de breedbandmodellering van verlieshebbende geleiders M Huynen | | 2019 |
| A 3-D differential surface admittance operator for the broadband modeling of lossy conductors M Huynen Ghent University, 2019 | | 2019 |
Dries Vande GinsteGhent UniversityVerified email at UGent.be
