Inaudible attack on smart speakers with intentional electromagnetic interference Z Xu, R Hua, J Juang, S Xia, J Fan, C Hwang IEEE Transactions on Microwave Theory and Techniques 69 (5), 2642-2650, 2021 | 26 | 2021 |
Jitter-aware economic pdn optimization with a genetic algorithm Z Xu, Z Wang, Y Sun, C Hwang, H Delingette, J Fan IEEE Transactions on Microwave Theory and Techniques 69 (8), 3715-3725, 2021 | 16 | 2021 |
Decoupling capacitor placement optimization with lagrange multiplier method Z Xu, J Wang, J Fan 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 16 | 2020 |
Radiated EMC Kron's model of 3-D multilayer pcb aggressed by broadband disturbance Z Xu, B Ravelo, O Maurice, J Gantet, N Marier IEEE Transactions on Electromagnetic Compatibility 62 (2), 406-414, 2019 | 16 | 2019 |
Multiport PDN optimization with the Newton–Hessian minimization method J Wang, Z Xu, X Chu, J Lu, B Ravelo, J Fan IEEE Transactions on Microwave Theory and Techniques 69 (4), 2098-2109, 2021 | 13 | 2021 |
Diakoptics modelling applied to flying bird-shape NGD microstrip circuit B Ravelo, F Wan, N Li, Z Xu, P Thakur, A Thakur IEEE Transactions on Circuits and Systems II: Express Briefs 68 (2), 637-641, 2020 | 13 | 2020 |
Original theory of NGD low pass-high pass composite function for designing inductorless BP NGD lumped circuit B Ravelo, S Ngoho, G Fontgalland, L Rajaoarisoa, W Rahajandraibe, ... IEEE Access 8, 192951-192964, 2020 | 11 | 2020 |
Multiphysics tensorial network analysis applied to PCB interconnect fatigue under thermal cycle aggression Z Xu, B Ravelo, O Maurice IEEE Transactions on Electromagnetic Compatibility 61 (4), 1253-1260, 2019 | 9 | 2019 |
Direct time-domain TAN model of 3D multilayer hybrid PCB: Experimental validation Z Xu, Y Liu, B Ravelo, J Gantet, N Marier, O Maurice IEEE Access 6, 60645-60654, 2018 | 9 | 2018 |
Multilayer power delivery network modeling with modified Kron's method (MKM) Z Xu, Y Liu, B Ravelo, O Maurice 2017 International Symposium on Electromagnetic Compatibility-EMC EUROPE, 1-6, 2017 | 9 | 2017 |
The sensitivity of ENRZ to crosstalk-in comparison to NRZ, PAM3, and PAM4 SS Chen, Z Xu, B Holden, A Tajalli 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 1116-1121, 2021 | 8 | 2021 |
Bandpass negative group delay theory of fully capacitive Δ-network F Wan, Y Liu, J Nebhen, Z Xu, G Chan, S Lallechere, R Vauche, ... IEEE Access 9, 62430-62445, 2021 | 8 | 2021 |
Modified Kron's TAN modeling of 3D multilayer PCB Z Xu, Y Liu, B Ravelo, O Maurice 2017 11th International Workshop on the Electromagnetic Compatibility of …, 2017 | 8 | 2017 |
Self-contact introduced passive intermodulation characterizations for captured springs J Li, S Xia, Z Xu, Y Xu, Y Wang, Y He, K Wu, N McDonnell, W Lee, H Zhou, ... 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 929-934, 2021 | 6 | 2021 |
Long short-term memory neural equalizer Z Wang, Z Xu, J He, H Delingette, J Fan IEEE Transactions on Signal and Power Integrity 2, 13-22, 2023 | 5 | 2023 |
Gassian Process Regression Analysis of Passive Intermodulation Level and DCR for Spring Contacts S Xia, J Li, Y Xu, Z Sun, Z Xu, Y Wang, Y He, N McDonnell, H Zhou, K Wu, ... 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 935-939, 2021 | 4 | 2021 |
A comparison of the s-parameter extrapolation methods SS Chen, Z Xu, A Tajali, B Holden 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2022 | 3 | 2022 |
High-Frequency Modeling of Permanent Magnet Synchronous Motor Considering Internal Imbalances Y Guo, M Ouyang, Z Xu, M Kim, J Lee, J Ha, H Lee, S Yun, J Fan, H Kim 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2021 | 3 | 2021 |
Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis B Ravelo, Z Xu Institution of Engineering and Technology, 2020 | 3 | 2020 |
Kron‐Branin modeling of symmetric star tree interconnect Z Xu, B Ravelo, O Maurice, S Lalléchère, F Wan International Journal of Circuit Theory and Applications 47 (3), 391-405, 2019 | 3 | 2019 |