| Energy per Operation Optimization for Energy-Harvesting Wearable IoT Devices J Park, G Bhat, A Nk, CS Geyik, UY Ogras, HG Lee Sensors 20 (3), 764, 2020 | 37 | 2020 |
| AustinMan and AustinWoman: High fidelity, reproducible, and open-source electromagnetic voxel models J Massey, C Geyik, N Techachainiran, C Hsu, R Nguyen, T Latson, M Ball, ... The 34th Annual Meeting of the Bioelectromagnetics Society, 2012 | 28 | 2012 |
| Impact of use conditions on dielectric and conductor material models for high-speed package interconnects CS Geyik, YS Mekonnen, Z Zhang, K Aygün IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 15 | 2019 |
| Error measures for comparing bioelectromagnetic simulators F Wei, JW Massey, CS Geyik, AE Yilmaz Proceedings of the 2012 IEEE International Symposium on Antennas and …, 2012 | 12 | 2012 |
| Machine learning for evaluating the impact of manufacturing process variations in high-speed interconnects CS Geyik, Z Zhang, K Aygün, JT Aberle 2021 22nd International Symposium on Quality Electronic Design (ISQED), 160-163, 2021 | 11 | 2021 |
| Temperature impact on surface roughness modeling for on-package high speed interconnects CS Geyik, Z Zhang, SR Christ, LE Wojewoda, K Aygün 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 9 | 2018 |
| Application of AIM to high-resolution bioelectromagnetics simulations T Malas, F Wei, J Massey, CS Geyik, AE Yılmaz Proc. Appl. Comp. Electromagnetics Symp, 558-563, 2011 | 9 | 2011 |
| Measurement uncertainty propagation in the validation of high-speed interconnects CS Geyik, MJ Hill, Z Zhang, K Aygün, JT Aberle 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 7 | 2020 |
| Energy-optimal gesture recognition using self-powered wearable devices J Park, G Bhat, CS Geyik, UY Ogras, HG Lee 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2018 | 7 | 2018 |
| A methodology to empirically compare computational bioelectromagnetics methods: Evaluation of three competitive methods JW Massey, F Wei, CS Geyik, AE Yılmaz IEEE Transactions on Antennas and Propagation 66 (8), 4123-4136, 2018 | 7 | 2018 |
| AustinMan electromagnetic voxels JW Massey, CS Geyik, M Ball, P Findell, AE Yilmaz AustinMan, 2013 | 7 | 2013 |
| Improved package modeling and correlation methodology for high speed IO design CS Geyik, Z Zhang, K Aygün 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 985-991, 2016 | 6 | 2016 |
| Accuracy-efficiency comparison of finite-difference time-domain and adaptive integral method based simulators for bioelectromagnetics CS Geyik | 6 | 2013 |
| A comparison of accuracy-efficiency tradeoffs of FDTD and FFT-accelerated integral equation methods for numerical dosimetry J Massey, F Wei, C Geyik, A Yilmaz Proc. BIOEM, 2013 | 5 | 2013 |
| Accurate BGA package solder joint modeling for high speed SerDes interfaces J Sun, Z Qian, CS Geyik, K Aygün 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 4 | 2020 |
| Optimizing Operations per Joule for Energy Harvesting IoT Devices J Park, G Bhat, CS Geyik, HG Lee, UY Ogras Technical Report, Arizona State University, 2018 | 4 | 2018 |
| Decoding human intent using a wearable system and multi-modal sensor data CS Geyik, A Dutta, UY Ogras, DW Bliss 2016 50th Asilomar Conference on Signals, Systems and Computers, 846-850, 2016 | 4 | 2016 |
| Impact of measurement uncertainty on correlation quality for high-speed interconnects CS Geyik, MJ Hill, Z Zhang, K Aygün, JT Aberle IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 3 | 2021 |
| 2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects CS Geyik, MJ Hill, Z Zhang, K Aygün, JT Aberle 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022 | 2 | 2022 |
| Density-graded adhesion layer for conductors RN Manepalli, K Aygun, SV Pietambaram, CS Geyik US Patent 11,508,676, 2022 | 1 | 2022 |
