| A critical review on multiaxial fatigue assessments of metals BR You, SB Lee International Journal of Fatigue 18 (4), 235-244, 1996 | 437 | 1996 |
| The tensile and low-cycle fatigue behavior of cold worked 316L stainless steel: influence of dynamic strain aging SG Hong, SB Lee International Journal of Fatigue 26 (8), 899-910, 2004 | 219 | 2004 |
| Mechanism of dynamic strain aging and characterization of its effect on the low-cycle fatigue behavior in type 316L stainless steel SG Hong, SB Lee Journal of Nuclear Materials 340 (2-3), 307-314, 2005 | 196 | 2005 |
| Dynamic strain aging under tensile and LCF loading conditions, and their comparison in cold worked 316L stainless steel SG Hong, SB Lee Journal of nuclear materials 328 (2-3), 232-242, 2004 | 122 | 2004 |
| A criterion for fully reversed out-of-phase torsion and bending SB Lee Multiaxial fatigue, 1985 | 110 | 1985 |
| Dynamic strain aging effect on the fatigue resistance of type 316L stainless steel SG Hong, KO Lee, SB Lee International Journal of Fatigue 27 (10-12), 1420-1424, 2005 | 100 | 2005 |
| Temperature effect on the low-cycle fatigue behavior of type 316L stainless steel: Cyclic non-stabilization and an invariable fatigue parameter SG Hong, SB Lee, TS Byun Materials Science and Engineering: A 457 (1-2), 139-147, 2007 | 96 | 2007 |
| Fatigue of polymer-supported Ag thin films GD Sim, Y Hwangbo, HH Kim, SB Lee, JJ Vlassak Scripta Materialia 66 (11), 915-918, 2012 | 92 | 2012 |
| Double-layer CVD graphene as stretchable transparent electrodes S Won, Y Hwangbo, SK Lee, KS Kim, KS Kim, SM Lee, HJ Lee, JH Ahn, ... Nanoscale 6 (11), 6057-6064, 2014 | 87 | 2014 |
| Tensile characteristics of metal nanoparticle films on flexible polymer substrates for printed electronics applications S Kim, S Won, GD Sim, I Park, SB Lee Nanotechnology 24 (8), 085701, 2013 | 80 | 2013 |
| Effects of stretching and cycling on the fatigue behavior of polymer-supported Ag thin films GD Sim, YS Lee, SB Lee, JJ Vlassak Materials Science and Engineering: A 575, 86-93, 2013 | 76 | 2013 |
| Finite-element analysis and X-ray measurement of the residual stresses of ceramic/metal joints SB Lee, JH Kim Journal of Materials Processing Technology 67 (1-3), 167-172, 1997 | 60 | 1997 |
| Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages SY Yang, YD Jeon, SB Lee, KW Paik Microelectronics Reliability 46 (2-4), 512-522, 2006 | 56 | 2006 |
| Improving the stretchability of as-deposited Ag coatings on poly-ethylene-terephthalate substrates through use of an acrylic primer GD Sim, S Won, C Jin, I Park, SB Lee, JJ Vlassak Journal of Applied Physics 109 (7), 2011 | 54 | 2011 |
| Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation WS Kwon, MJ Yim, KW Paik, SJ Ham, SB Lee J. Electron. Packag. 127 (2), 86-90, 2005 | 50 | 2005 |
| Thermal deformations of CSP assembly during temperature cycling and power cycling SJ Ham, MS Cho, SB Lee International Symposium on Electronic Materials and Packaging (EMAP2000)(Cat …, 2000 | 45 | 2000 |
| A mechanistic model for fatigue life prediction of solder joints for electronic packages SB Lee, JK Kim International journal of fatigue 19 (1), 85-91, 1997 | 45 | 1997 |
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load I Kim, SB Lee IEEE Transactions on components and packaging technologies 31 (2), 478-484, 2008 | 44 | 2008 |
| Analysis on failures of protective-oxide layers and cyclic oxidation CO Moon, SB Lee Oxidation of metals 39, 1-13, 1993 | 42 | 1993 |
| A study on the thermal fatigue behavior of solder joints under power cycling conditions SY Yang, I Kim, SB Lee IEEE Transactions on Components and Packaging Technologies 31 (1), 3-12, 2008 | 34 | 2008 |
Seong-Gu HongPrincipal research scientist, Korea Research Institute of Standards and ScienceBestätigte E-Mail-Adresse bei kriss.re.kr
