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Eric Vagnon
Eric Vagnon
Verified email at ec-lyon.fr
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Cited by
Cited by
Year
A bus-bar-like power module based on three-dimensional power-chip-on-chip hybrid integration
E Vagnon, PO Jeannin, JC Crebier, Y Avenas
IEEE Transactions on industry applications 46 (5), 2046-2055, 2010
562010
Series connection of IGBT
T Van Nguyen, PO Jeannin, E Vagnon, D Frey, JC Crebier
2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and …, 2010
392010
Series connection of IGBTs with self-powering technique and 3-D topology
T Van Nguyen, PO Jeannin, E Vagnon, D Frey, JC Crebier
IEEE Transactions on Industry Applications 47 (4), 1844-1852, 2011
352011
Study and realization of a low force 3D press-pack power module
E Vagnon, JC Crébier, Y Avenas, PO Jeannin
2008 IEEE Power Electronics Specialists Conference, 1048-1054, 2008
242008
AC breakdown voltage and partial discharge activity in synthetic ester-based fullerene and graphene nanofluids
H Khelifa, E Vagnon, A Beroual
IEEE Access 10, 5620-5634, 2022
172022
A busbar like power module based on 3D chip on chip hybrid integration
E Vagnon, PO Jeannin, Y Avenas, JC Crébier, K Guépratte
2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and …, 2009
112009
Solutions innovantes pour le packaging de convertisseurs statiques polyphasés
E Vagnon
Institut National Polytechnique de Grenoble-INPG, 2010
102010
Electrical characterization of a pressed contact between a power chip and a metal electrode
E Vagnon, Y Avenas, JC Crébier, PO Jeannin, I Al Batta, A Besri
2009 IEEE Instrumentation and Measurement Technology Conference, 1738-1743, 2009
102009
Effect of conducting, semi-conducting and insulating nanoparticles on ac breakdown voltage and partial discharge activity of synthetic ester: a statistical analysis
H Khelifa, A Beroual, E Vagnon
Nanomaterials 12 (12), 2105, 2022
42022
Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester
S Anand, E Vagnon, A Zouaghi, M Guillet, C Buttay, O Agri
2021 IEEE Electrical Insulation Conference (EIC), 602-605, 2021
42021
Insulating liquids, an alternative to silicone gel for power electronic devices
O Agri, JL Auge, E Vagnon, F Buret
2019 IEEE Electrical Insulation Conference (EIC), 299-303, 2019
32019
TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges
WF Bikinga, B Mezrag, Y Avenas, JL Schanen, JM Guichon, K Alkama, ...
2021 Third International Symposium on 3D Power Electronics Integration and …, 2021
22021
Numerical study of a liquid metal heat spreader for power semiconductor devices
M Tawk, Y Avenas, E Vagnon, A Msaed
2012 IEEE Energy Conversion Congress and Exposition (ECCE), 85-90, 2012
22012
Etudes de faisabilité d'un module de puissance 3D de type presspack pour des applications de faible et moyenne puissances
E Vagnon, JC Crébier, PO Jeannin
22008
A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics
ASO Al-Hinaai, T Huesgen, C Buttay, E Vagnon, R Zeitler, D Meyer
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP), 1-6, 2022
12022
Assessment of partial discharge phenomenon in AC and fast-rising square voltage using optical detection technique in needle-plane configuration with pressboard in mineral oil
S Anand, E Vagnon, M Guillet, C Buttay
2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), 1-4, 2022
12022
Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil
A Zouaghi, O Agri, E Vagnon, JL Auge
2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena …, 2020
12020
Comparison of Different Insulating Liquids for PCB Embedded Power Modules
O Agri, E Vagnon, A Zouaghi, JL Auge
2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena …, 2020
12020
Packaging à l'échelle du wafer pour les semi-conducteurs de puissance dans les convertisseurs multicellulaires
N ROUGER, L BENAISSA, J WIDIEZ, J DA FONSECA, D LAFOND, ...
European journal of electrical engineering 16 (3-4), 307-322, 2013
12013
Packaging à l'échelle du wafer pour les convertisseurs multicellulaires
N Rouger, L Benaissa, JC Crébier, J Widiez, J Defonseca, D Lafond, ...
Electronique de Puissance du Futur 2012, 2012
12012
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