| Time-resolved temperature measurement of AlGaN/GaN electronic devices using micro-Raman spectroscopy M Kuball, GJ Riedel, JW Pomeroy, A Sarua, MJ Uren, T Martin, KP Hilton, ... IEEE electron device letters 28 (2), 86-89, 2007 | 167 | 2007 |
| Reducing thermal resistance of AlGaN/GaN electronic devices using novel nucleation layers GJ Riedel, JW Pomeroy, KP Hilton, JO Maclean, DJ Wallis, MJ Uren, ... IEEE Electron Device Letters 30 (2), 103-106, 2008 | 98 | 2008 |
| Nanosecond timescale thermal dynamics of AlGaN/GaN electronic devices GJ Riedel, JW Pomeroy, KP Hilton, JO Maclean, DJ Wallis, MJ Uren, ... IEEE Electron Device Letters 29 (5), 416-418, 2008 | 61 | 2008 |
| On reliability of medium voltage multilevel converters R Grinberg, G Riedel, A Korn, P Steimer, E Bjornstad 2013 IEEE Energy Conversion Congress and Exposition, 4047-4052, 2013 | 53 | 2013 |
| Syntheses and Energy Transfer in Multiporphyrinic Arrays Self‐Assembled with Hydrogen‐Bonding Recognition Groups and Comparison with Covalent Steroidal Models TS Balaban, N Berova, CM Drain, R Hauschild, X Huang, H Kalt, ... Chemistry–A European Journal 13 (30), 8411-8427, 2007 | 53 | 2007 |
| A study on IGBT junction temperature (Tj) online estimation using gate-emitter voltage (Vge) at turn-off VK Sundaramoorthy, E Bianda, R Bloch, D Angelosante, I Nistor, ... Microelectronics Reliability 54 (11), 2423-2431, 2014 | 31 | 2014 |
| Integration technologies for a fully modular and hot-swappable MV multi-level concept converter D Cottet, W van der Merwe, F Agostini, G Riedel, N Oikonomou, ... Proceedings of PCIM Europe 2015; International Exhibition and Conference for …, 2015 | 30 | 2015 |
| Reliability of large area solder joints within IGBT modules: Numerical modeling and experimental results GJ Riedel, R Schmidt, C Liu, H Beyer, I Alaperae 2012 7th international conference on integrated power electronics systems …, 2012 | 30 | 2012 |
| Thermal properties and reliability of GaN microelectronics: Sub-micron spatial and nanosecond time resolution thermography M Kuball, JW Pomeroy, R Simms, GJ Riedel, H Ji, A Sarua, MJ Uren, ... 2007 IEEE Compound Semiconductor Integrated Circuits Symposium, 1-4, 2007 | 28 | 2007 |
| PWM for active thermal protection in three level neutral point clamped inverters TM Phan, N Oikonomou, GJ Riedel, M Pacas 2014 IEEE Energy Conversion Congress and Exposition (ECCE), 3710-3716, 2014 | 25 | 2014 |
| PWM for active thermal protection in three level neutral point clamped inverters TM Phan, N Oikonomou, GJ Riedel, M Pacas 2014 IEEE Energy Conversion Congress and Exposition (ECCE), 3710-3716, 2014 | 25 | 2014 |
| The influence of thermal cycling methods on the interconnection reliability evaluation within IGBT modules C Liu, F Brem, G Riedel, E Eichelberger, N Hofmann 2012 4th Electronic System-Integration Technology Conference, 1-5, 2012 | 23 | 2012 |
| Online junction temperature estimation for IGBT modules with paralleled semiconductor chips VK Sundaramoorthy, E Bianda, M Kamel, GJ Riedel, I Nistor 7th IET International Conference on Power Electronics, Machines and Drives …, 2014 | 19 | 2014 |
| Simultaneous testing of wirebond and solder fatigue in IGBT modules GJ Riedel, M Valov CIPS 2014; 8th International Conference on Integrated Power Electronics …, 2014 | 18 | 2014 |
| Active thermal protection and lifetime extension in 3L-NPC-inverter in the low modulation range TM Phan, GJ Riedel, N Oikonomou, M Pacas 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 2269-2276, 2015 | 16 | 2015 |
| Electronic device with waterproof enclosure T Huesgen, C Schrödl, D Kearney, G Riedel, J Sukanen, J Tuomola, ... US Patent 9,485,891, 2016 | 15 | 2016 |
| Reliability prediction sensitivity analysis—How to perform reliability prediction time efficiently GJ Riedel, T Huesgen, R Schmidt 6th IET International Conference on Power Electronics, Machines and Drives …, 2012 | 11 | 2012 |
| Thermal networks for time-variant cooling systems: modeling approach and accuracy requirements for lifetime prediction T Gradinger, G Riedel 2012 7th International Conference on Integrated Power Electronics Systems …, 2012 | 10 | 2012 |
| Current capability of press-fit contacts of IGBT modules GJ Riedel, C Spindler, I Alaperä, R Schmidt, M Held IET Digital Library, 2012 | 10 | 2012 |
| Electric converter with compact module arrangement for subsea applications G Riedel, S Kicin, T Gradinger US Patent 9,668,376, 2017 | 9 | 2017 |
