| Investigation of thermal management materials for automotive electronic control units S Mallik, N Ekere, C Best, R Bhatti Applied Thermal Engineering 31 (2-3), 355-362, 2011 | 232 | 2011 |
| Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges KC Otiaba, NN Ekere, RS Bhatti, S Mallik, MO Alam, EH Amalu Microelectronics Reliability 51 (12), 2031-2043, 2011 | 145 | 2011 |
| Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes R Durairaj, S Ramesh, S Mallik, A Seman, N Ekere Materials & Design 30 (9), 3812-3818, 2009 | 117 | 2009 |
| Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach KC Otiaba, RS Bhatti, NN Ekere, S Mallik, M Ekpu Engineering Failure Analysis 28, 192-207, 2013 | 73 | 2013 |
| Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly R Durairaj, S Mallik, A Seman, A Marks, NN Ekere Journal of materials processing technology 209 (8), 3923-3930, 2009 | 70 | 2009 |
| Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions JA Depiver, S Mallik, EH Amalu Engineering Failure Analysis 125, 105447, 2021 | 64 | 2021 |
| Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu Microelectronics Reliability 52 (7), 1409-1419, 2012 | 60 | 2012 |
| Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process EH Amalu, NN Ekere, S Mallik Materials & Design 32 (6), 3189-3197, 2011 | 60 | 2011 |
| Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba Microelectronics Reliability 54 (1), 239-244, 2014 | 53 | 2014 |
| Effective solder for improved thermo-mechanical reliability of solder joints in a ball grid array (BGA) soldered on printed circuit board (PCB) JA Depiver, S Mallik, EH Amalu Journal of Electronic Materials 50, 263-282, 2021 | 42 | 2021 |
| A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits EH Amalu, WK Lau, NN Ekere, RS Bhatti, S Mallik, KC Otiaba, G Takyi Microelectronic Engineering 88 (7), 1610-1617, 2011 | 36 | 2011 |
| The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes R Durairaj, LW Man, NN Ekere, S Mallik Materials & Design 31 (3), 1056-1062, 2010 | 35 | 2010 |
| Solder joint failures under thermo-mechanical loading conditions–A review J Depiver, S Mallik, D Harmanto Advances in Materials and Processing Technologies 7 (1), 1-26, 2021 | 33 | 2021 |
| Solder paste characterisation: towards the development of quality control (QC) tool R Durairaj, S Mallik, NN Ekere Soldering & Surface mount technology 20 (3), 34-40, 2008 | 24 | 2008 |
| Investigation of effects of heat sinks on thermal performance of microelectronic package M Ekpu, R Bhatti, N Ekere, S Mallik, E Amalu, K Otiaba 3rd IEEE International Conference on Adaptive Science and Technology (ICAST …, 2011 | 23 | 2011 |
| CFD simulation of solder paste flow and deformation behaviours during stencil printing process. V Thakur, S Mallik, V Vuppala International Journal of Recent Advances in Mechanical Engineering, 2015 | 22 | 2015 |
| Advanced thermal management materials for heat sinks used in microelectronics M Ekpu, R Bhatti, N Ekere, S Mallik 18th European Microelectronics & Packaging Conference, 1-8, 2011 | 22 | 2011 |
| Stencil printing behavior of lead-free Sn-3Ag-0.5 Cu solder paste for wafer level bumping for sub-100 μm size solder bumps S Kumar, S Mallik, N Ekere, J Jung Metals and Materials International 19, 1083-1090, 2013 | 21 | 2013 |
| Influence of solder paste components on rheological behaviour S Mallik, M Schmidt, R Bauer, NN Ekere 2008 2nd Electronics System-Integration Technology Conference, 1135-1140, 2008 | 20 | 2008 |
| Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications S Mallik, NN Ekere, R Durairaj, AE Marks, A Seman Materials & Design 30 (10), 4502-4506, 2009 | 19 | 2009 |
![Dr Emeka Amalu [BEng (Hons), MEng, PhD, PG Cert HE, CEng, MIMechE, MIET, FHEA]](/scholar/images/cleardot.gif)
Dr Emeka Amalu [BEng (Hons), MEng,...Associate Professor of Mechanical Engineering, Teesside University, Middlesbrough, UKBestätigte E-Mail-Adresse bei tees.ac.uk![Dr Emeka Amalu [BEng (Hons), MEng, PhD, PG Cert HE, CEng, MIMechE, MIET, FHEA]](https://scholar.googleusercontent.com/citations?view_op=small_photo&user=MVa79dgAAAAJ&citpid=2)
