| Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability M Xiao, B Wang, J Liu, R Zhang, Z Zhang, C Ding, S Lu, K Sasaki, GQ Lu, ... IEEE Transactions on Power Electronics 36 (8), 8565-8569, 2021 | 89 | 2021 |
| Characterization of a nonlinear resistive polymer-nanoparticle composite coating for electric field reduction in a medium-voltage power module Z Zhang, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 37 (3), 2475-2479, 2021 | 30 | 2021 |
| Packaging of a 10-kV double-side cooled Silicon Carbide diode module with thin substrates coated by a nonlinear resistive polymer-nanoparticle composite Z Zhang, S Lu, B Wang, Y Zhang, N Yun, W Sung, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 37 (12), 14462-14470, 2022 | 18 | 2022 |
| Low parasitic-inductance packaging of a 650 V/150 a half-bridge module using enhancement-mode Gallium-Nitride high electron mobility transistors S Lu, T Zhao, Z Zhang, KDT Ngo, R Burgos, GQ Lu IEEE Transactions on Industrial Electronics 70 (1), 344-351, 2022 | 16 | 2022 |
| Desired properties of a nonlinear resistive coating for shielding triple point in a medium-voltage power module J Xu, Z Zhang, KDT Ngo, GQ Lu IEEE Transactions on Dielectrics and Electrical Insulation 28 (5), 1721-1728, 2021 | 16 | 2021 |
| Packaging of an 8-kV silicon carbide diode module with double-side cooling and sintered-silver joints Z Zhang, J Zhang, J Xu, KDT Ngo, GQ Lu, E Cousineau, P Paret, ... 2021 IEEE Electric Ship Technologies Symposium (ESTS), 1-7, 2021 | 14 | 2021 |
| Chip size minimization for wide and ultrawide bandgap power devices B Wang, M Xiao, Z Zhang, Y Wang, Y Qin, Q Song, GQ Lu, K Ngo, ... IEEE Transactions on Electron Devices 70 (2), 633-639, 2023 | 11 | 2023 |
| Packaging of a 15-kV silicon carbide MOSFET with insulation enhanced by a nonlinear resistive polymer-nanoparticle coating Z Zhang, S Lu, C Nicholas, N Yun, W Sung, KDT Ngo, GQ Lu 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-4, 2022 | 6 | 2022 |
| Field-Grading Effect of a Nonlinear Resistive Polymer-Nanoparticle Composite Triple-Point Coating on Direct-Bond Copper Substrates for Packaging Medium-Voltage Power Devices Z Zhang, Q Yuchi, F Boshkovski, KDT Ngo, GQ Lu 2022 IEEE Electrical Insulation Conference (EIC), 439-442, 2022 | 5 | 2022 |
| Improved measurement accuracy for junction-to-case thermal resistance of GaN HEMT packages by gate-to-gate electrical resistance and stacking thermal interface materials S Lu, Z Zhang, C Buttay, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 37 (6), 6285-6289, 2022 | 5 | 2022 |
| Double-Side Cooled SiC MOSFET Power Modules with Sintered-Silver Interposers for a 100 kW/L Traction Inverter C Ding, S Lu, Z Zhang, K Zhang, T Nguyen, KDT Ngo, R Burgos, GQ Lu IEEE Transactions on Power Electronics, 2023 | 4 | 2023 |
| Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating Z Zhang, C Nicholas, A Emmanuel, KDT Ngo, GQ Lu, J Lynch, N Yun, ... 2023 25th European Conference on Power Electronics and Applications (EPE'23 …, 2023 | 1 | 2023 |
| Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module With Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating Z Zhang, C Nicholas, KDT Ngo, GQ Lu 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 1622-1626, 2023 | 1 | 2023 |
| Evaluation of a nonlinear resistive polymer-nanoparticle composite for field-grading in a double-side cooled 10-kV silicon carbide rectifier module Z Zhang, KDT Ngo, W Sung, GQ Lu CIPS 2022; 12th International Conference on Integrated Power Electronics …, 2022 | 1 | 2022 |
| Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor S Lu, B Li, E Arriola, Z Zhang, C Nicholas, KDT Ngo, GQ Lu IEEE Transactions on Industrial Electronics, 2024 | | 2024 |
| Effective Field Grading at 200° C of a Nonlinear Resistive Polymer Nanocomposite Coating for Medium-Voltage Power Modules Z Zhang, Q Yuchi, C Nicholas, KDT Ngo, GQ Lu IEEE Transactions on Power Electronics 39 (4), 3974-3978, 2024 | | 2024 |
| Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating Z Zhang, E Arriola, C Nicholas, J Lynch, N Yun, A Morgan, W Sung, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Enhancing Electrical Insulation of Medium-Voltage Power Modules by a Nonlinear Resistive Polymer Nanocomposite Coating Z Zhang, KDT Ngo, GQ Lu GOMACTech 2024, 2024 | | 2024 |
| Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating Z Zhang, S Lu, C Nicholas, J Lynch, A Morgan, W Sung, KDT Ngo, GQ Lu 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA …, 2023 | | 2023 |
| Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sandwiched Between a PCB and DBC Substrate C Nicholas, F Boshkovski, E Arriola, Z Zhang, GQ Lu 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA …, 2023 | | 2023 |
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEVerified email at vt.edu
