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Co-authors
- Yuanming ShiProfessor, ShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Zhi DingDistinguished Professor of Electrical and Computer Engineering, University of California DavisVerified email at ucdavis.edu
- Tao JiangQualcommVerified email at mail.utoronto.ca
- Yong ZhouShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Khaled B. LetaiefMember of US National Academy of Engineering and New Bright Professor of Engineering, HKUSTVerified email at ust.hk
- Jun ZhangHong Kong University of Science and Technology, IEEE FellowVerified email at ust.hk
- Liqun FuFull Professor, Xiamen UniversityVerified email at xmu.edu.cn
- Wei ChenProfessor, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Tao Fan (范涛)Tech Leader@WeBankVerified email at webank.com
- Wei YuUniversity of TorontoVerified email at ece.utoronto.ca
- Pan DuRenmin University of ChinaVerified email at ruc.edu.cn
- Yujin HanThe University of Hong KongVerified email at connect.hku.hk
- Youlong WUShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Hao WangShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Qiang Yang (杨强)Chief AI Officer@WeBank, Prof. Emeritus @HKUST, IJCAI President 2017-19, AAAI-21 General ChairVerified email at cse.ust.hk