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Pierre-olivier Jeannin
Pierre-olivier Jeannin
G2ELab
Verified email at g2elab.grenoble-inp.fr
Title
Cited by
Cited by
Year
Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermosensitive electrical parameters
L Dupont, Y Avenas, PO Jeannin
IEEE Transactions on Industry Applications 49 (4), 1599-1608, 2013
2052013
High frequency DC-DC converter using GaN device
J Delaine, PO Jeannin, D Frey, K Guepratte
2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and …, 2012
1062012
Optimisation and integration of an active clamping circuit for IGBT series association
J Saiz, M Mermet, D Frey, PO Jeannin, JL Schanen, P Muszicki
Conference Record of the 2001 IEEE Industry Applications Conference. 36th …, 2001
922001
Optimized Power Modules for Silicon Carbide mosfet
G Regnat, PO Jeannin, D Frey, J Ewanchuk, SV Mollov, JP Ferrieux
IEEE Transactions on Industry Applications 54 (2), 1634-1644, 2017
632017
A bus-bar-like power module based on three-dimensional power-chip-on-chip hybrid integration
E Vagnon, PO Jeannin, JC Crebier, Y Avenas
IEEE Transactions on industry applications 46 (5), 2046-2055, 2010
552010
SIC power devices in power electronics: An overview
LFS Alves, RCM Gomes, P Lefranc, RA Pegado, PO Jeannin, BA Luciano, ...
2017 Brazilian Power Electronics Conference (COBEP), 1-8, 2017
472017
Retail display strap for securing a tie to a shirt
C Kim
US Patent 6,901,636, 2005
462005
Complete analytical calculation of static leakage parameters: A step toward HF transformer optimization
X Margueron, A Besri, PO Jeannin, JP Keradec, G Parent
IEEE Transactions on Industry Applications 46 (3), 1055-1063, 2010
422010
Series connection of IGBT
T Van Nguyen, PO Jeannin, E Vagnon, D Frey, JC Crebier
2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and …, 2010
402010
Original cabling conditions to insure balanced current during switching transitions between paralleled semiconductors
PO Jeannin, JL Schanen, E Clavel
IEEE Transactions on Industry Applications 38 (1), 181-188, 2002
372002
Above 2000 V breakdown voltage at 600 K GaN‐on‐silicon high electron mobility transistors
N Herbecq, I Roch‐Jeune, A Linge, M Zegaoui, PO Jeannin, N Rouger, ...
physica status solidi (a) 213 (4), 873-877, 2016
362016
Combination of power flow controller and short-circuit limiter in distribution electrical network using a cascaded H-bridge distribution-static synchronous series compensator
M Saradarzadeh, S Farhangi, JL Schanen, PO Jeannin, D Frey
IET Generation, Transmission & Distribution 6 (11), 1121-1131, 2012
362012
Series connection of IGBTs with self-powering technique and 3-D topology
T Van Nguyen, PO Jeannin, E Vagnon, D Frey, JC Crebier
IEEE Transactions on Industry Applications 47 (4), 1844-1852, 2011
352011
Silicon carbide power chip on chip module based on embedded die technology with paralleled dies
G Regnat, PO Jeannin, G Lefevre, J Ewanchuk, D Frey, S Mollov, ...
2015 IEEE Energy Conversion Congress and Exposition (ECCE), 4913-4919, 2015
342015
Review on SiC-MOSFET devices and associated gate drivers
LFS Alves, P Lefranc, PO Jeannin, B Sarrazin
2018 IEEE international conference on industrial technology (ICIT), 824-829, 2018
332018
Implementation and switching behavior of a PCB-DBC IGBT module based on the power chip-on-chip 3-D concept
JL Marchesini, PO Jeannin, Y Avenas, J Delaine, C Buttay, R Riva
IEEE Transactions on Industry Applications 53 (1), 362-370, 2016
282016
Application of cascaded H-bridge distribution-static synchronous series compensator in electrical distribution system power flow control
M Saradarzadeh, S Farhangi, JL Schanen, PO Jeannin, D Frey
IET Power Electronics 5 (9), 1660-1675, 2012
262012
Improvement of GaN transistors working conditions to increase efficiency of A 100W DC-DC converter
J Delaine, PO Jeannin, D Frey, K Guepratte
2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and …, 2013
242013
Study and realization of a low force 3D press-pack power module
E Vagnon, JC Crébier, Y Avenas, PO Jeannin
2008 IEEE Power Electronics Specialists Conference, 1048-1054, 2008
242008
Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter
G Perez, G Chicot, Y Avenas, P Lefranc, PO Jeannin, D Eon, N Rouger
Diamond and Related Materials 78, 83-87, 2017
222017
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