| Autonomous real-time ground ubiquitous surveillance-imaging system (ARGUS-IS) B Leininger, J Edwards, J Antoniades, D Chester, D Haas, E Liu, ... Defense Transformation and Net-Centric Systems 2008 6981, 141-151, 2008 | 86 | 2008 |
| Fin profile structure and method of making same CW Chang, CF Liu, C Peng, TC Huang, RCJ Chen US Patent 8,546,891, 2013 | 46 | 2013 |
| FinFET device structure and methods of making same YC Lin, CH Wu, ECF Liu, RCJ Chen, CC Chen US Patent 8,900,937, 2014 | 25 | 2014 |
| Method for processing photoresist materials and structures N Mohanty, ECF Liu, E Franke US Patent 10,049,892, 2018 | 19* | 2018 |
| Process of manufacturing Fin-FET device CW Chang, A Chang, ECF Liu, RCJ Chen, LIN Chia-Tai, C Peng US Patent 9,704,974, 2017 | 19 | 2017 |
| Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme N Mohanty, E Franke, E Liu, A Raley, J Smith, R Farrell, M Wang, K Ito, ... Advanced Etch Technology for Nanopatterning IV 9428, 67-80, 2015 | 19 | 2015 |
| Outlook for high-NA EUV patterning: a holistic patterning approach to address upcoming challenges A Raley, L Huli, S Grzeskowiak, K Lutker-Lee, A Krawicz, Y Feurprier, ... Advanced Etch Technology and Process Integration for Nanopatterning XI 12056 …, 2022 | 18 | 2022 |
| Defect detection strategies and process partitioning for SE EUV patterning L Meli, K Petrillo, A De Silva, J Arnold, N Felix, C Robinson, B Briggs, ... Extreme Ultraviolet (EUV) Lithography IX 10583, 87-103, 2018 | 17 | 2018 |
| Simultaneous formation of source/drain openings with different profiles ECF Liu, S Thitinun, WU Dai-Lin, RCJ Chen, CC Chen US Patent 9,263,551, 2016 | 16 | 2016 |
| FinFETs with regrown source/drain and methods for forming the same ECF Liu, TW Kao, RCJ Chen, CC Chen US Patent 9,034,706, 2015 | 15 | 2015 |
| Dispense system of a photoresist coating machine MC Yang, KF Huang, E Liu, ET Tan US Patent 6,062,442, 2000 | 13 | 2000 |
| Photoresist solution storage and supply device E Liu US Patent 5,871,028, 1999 | 12 | 1999 |
| Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features A Dutta, J Church, J Lee, B O’Brien, L Meli, CC Liu, S Sharma, K Petrillo, ... Extreme Ultraviolet (EUV) Lithography XI 11323, 213-224, 2020 | 11 | 2020 |
| Defect detection strategies and process partitioning for single-expose EUV patterning L Meli, K Petrillo, A De Silva, J Arnold, N Felix, C Robinson, B Briggs, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 18 (1), 011006-011006, 2019 | 11 | 2019 |
| Benchmarking of EUV lithography line/space patterning versus immersion lithography multipatterning schemes at equivalent pitch A Raley, C Mack, S Thibaut, E Liu, A Ko International Conference on Extreme Ultraviolet Lithography 2018 10809, 183-201, 2018 | 10 | 2018 |
| A 32Gb/s NRZ 37dB SerDes in 10nm CMOS to support PCI express gen 5 protocol M Bichan, C Ting, B Zand, J Wang, R Shulyzki, J Guthrie, K Tyshchenko, ... 2020 IEEE Custom Integrated Circuits Conference (CICC), 1-4, 2020 | 9 | 2020 |
| Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same R Clark, ECF Liu, A Raley, H Tuitje, K Siefering US Patent App. 16/356,345, 2020 | 9 | 2020 |
| Characterization of Surface Variation of Chemically Amplified Photoresist to Evaluate Extreme Ultraviolet Lithography Stochastics Effects E Liu, A Hegazy, H Choi, M Weires, R Brainard, G Denbeaux Journal of photopolymer science and technology 34 (1), 63-70, 2021 | 8 | 2021 |
| Fin profile structure and method of making same CW Chang, CF Liu, C Peng, TC Huang, RCJ Chen US Patent 8,658,539, 2014 | 7 | 2014 |
| Method for reducing lithography defects and pattern transfer AD Raley, ECF Liu, N Mohanty US Patent 11,333,968, 2022 | 6 | 2022 |
