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Co-authors
- Ben KaczerimecVerified email at imec.be
- Michael WaltlFull Professor at TU Wien, Vienna, AustriaVerified email at iue.tuwien.ac.at
- Siegfried SelberherrInstitute for Microelectronics, TU WienVerified email at TUWien.ac.at
- Jacopo FrancoimecVerified email at imec.be
- Hans ReisingerInfineon AGVerified email at infineon.com
- Theresia KnoblochResearcher, TU WienVerified email at iue.tuwien.ac.at
- Yury Illarionov (Юрий Юрьевич Илла...Southern University of Science and Technology (SUSTech)Verified email at sustech.edu.cn
- Guido Groesenekenimec and KU LeuvenVerified email at imec.be
- Gerhard RzepaGlobal TCAD SolutionsVerified email at globaltcad.com
- Gregor PobegenSenior staff engineer, KAI GmbH, AustriaVerified email at k-ai.at
- Michael NelhiebelKAI GmbH / Infineon Technologies Austria AGVerified email at infineon.com
- Franz SchanovskyGlobal TCAD Solutions GmbHVerified email at chello.at
- Dominic WaldhörPostdoctoral Researcher, Institute for Microelectronics, TU WienVerified email at iue.tuwien.ac.at
- Al-Moatasem El-SayedNanolayers Research Computing Ltd. & Technical University of ViennaVerified email at ucl.ac.uk
- Alexander Grillprinciple researcher, imecVerified email at imec.be
- Dimitri LintenImecVerified email at imec.be
- Bernhard StampferInstitute for Microelectronics, TU WienVerified email at iue.tuwien.ac.at
- Karl RuppTU WienVerified email at karlrupp.net
- Dr. Hajdin CericInstitut für Mikroelektronik, TU WienVerified email at iue.tuwien.ac.at
- Thomas MuellerVienna University of TechnologyVerified email at tuwien.ac.at