| Semiconductor Package and Method of Manufacturing the Same B Pu, J Pak, JY Park, S Nam US Patent 20,210,028,100, 2019 | 66* | 2019 |
| Modeling and parameter extraction of coplanar symmetrical meander lines B Pu, KH Kim, SY Kim, W Nah IEEE Transactions on Electromagnetic Compatibility 57 (3), 375-383, 2015 | 22 | 2015 |
| Electromagnetic susceptibility analysis of ICs using DPI method with consideration of PDN B Pu, JJ Lee, SK Kwak, SY Kim, W Nah 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, 77-80, 2012 | 17 | 2012 |
| Efficient DC and AC impedance calculation for arbitrary-shape and multilayer PDN using boundary integration L Zhang, J Juang, Z Kiguradze, B Pu, S Jin, S Wu, Z Yang, EP Li, J Fan, ... IEEE Transactions on Signal and Power Integrity 1, 1-11, 2022 | 13 | 2022 |
| Fast impedance prediction for power distribution network using deep learning L Zhang, J Juang, Z Kiguradze, B Pu, S Jin, S Wu, Z Yang, J Fan, ... International Journal of Numerical Modelling: Electronic Networks, Devices …, 2022 | 11 | 2022 |
| A modified genetic algorithm for the selection of decoupling capacitors in pdn design J Juang, L Zhang, Z Kiguradze, B Pu, S Jin, C Hwang 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 712-717, 2021 | 10 | 2021 |
| Immunity enhancement of the power distribution network in integrated circuits with coplanar meander lines in package B Pu, J Fan, W Nah IEEE Transactions on Electromagnetic Compatibility 62 (5), 2238-2246, 2020 | 9 | 2020 |
| The simulated TDR impedance in PCB material characterization Y Guo, DH Kim, J He, S Yong, Y Liu, B Pu, X Ye, J Fan 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 831-834, 2021 | 8 | 2021 |
| Far-end crosstalk control strategy for high-volume high-speed PCB manufacturing: The concept of critical resin content percent Y Guo, S Yong, Y Liu, J He, B Pu, X Ye, A Sutono, V Kunda, A Luoh, ... 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 820-824, 2021 | 8 | 2021 |
| Training set optimization in an artificial neural network constructed for high bandwidth interconnects design B Pu, H Kim, XD Cai, B Sen, C Sui, J Fan IEEE Transactions on Microwave Theory and Techniques 70 (6), 2955-2964, 2022 | 7 | 2022 |
| Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin B Pu, J He, A Harmon, Y Guo, Y Liu, Q Cai 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 492-497, 2021 | 7 | 2021 |
| Prepreg and Core Dielectric Permittivity (ϵr) Extraction for Fabricated Striplines’ Far-End Crosstalk Modeling S Yong, S Penugonda, DH Kim, V Khilkevich, B Pu, X Ye, Q Gao, XD Cai, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 209-218, 2021 | 7 | 2021 |
| A de-embedding technique of a three-port network with two ports coupled B Pu, J Kim, W Nah Journal of electromagnetic engineering and science 15 (4), 258-265, 2015 | 7 | 2015 |
| Estimation of transferred power from a noise source to an IC with forwarded power characteristics B Pu, T Kim, SJ Kim, JH Kim, SY Kim, W Nah Journal of electromagnetic engineering and science 13 (4), 233-239, 2013 | 7 | 2013 |
| Design of 2.5 D interposer in high bandwidth memory and through silicon via for high speed signal B Pu, JS Pak, C Jo, S Moon UBM DesignCon Conference, 2019 | 6* | 2019 |
| A Novel Machine-Learning-Based Batch Selection Method in Sparse Near-Field Scanning L Zhang, YR Feng, B Pu, XD Cai, D Li, XC Wei, B Mutnury, J Fan, H Chen, ... IEEE Transactions on Microwave Theory and Techniques 70 (11), 5019-5028, 2022 | 5 | 2022 |
| Prediction of impedance characteristics of MLCC using multiconductor transmission line theory J Jeon, H Lee, B Pu, JH Kim, N Zhang, W Nah IEEE Transactions on Electromagnetic Compatibility 58 (6), 1760-1771, 2016 | 5 | 2016 |
| Analysis of filtering characteristics for coplanar symmetrical meander lines B Pu, K Kim, J Yousaf, W Nah 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2016 | 5 | 2016 |
| Package design methodology in consideration with signal integrity, power integrity and electromagnetic immunity B Pu, K Kim, W Nah 2014 XXXIth URSI General Assembly and Scientific Symposium (URSI GASS), 1-4, 2014 | 5 | 2014 |
| Modeling and prediction of electromagnetic immunity for integrated circuits B Pu, T Kim, SJ Kim, SY Kim, W Nah Journal of electromagnetic engineering and science 13 (1), 54-61, 2013 | 5 | 2013 |
DongHyun (Bill) KimAssistant Professor, Missouri University of Science and TechnologyBestätigte E-Mail-Adresse bei mst.edu
