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Jürgen Wilde
Jürgen Wilde
Professor für Mikrosystemtechnik, Albert-Ludwigs-Universität Freiburg
Verified email at imtek.uni-freiburg.de - Homepage
Title
Cited by
Cited by
Year
Mechanical properties of silicones for MEMS
F Schneider, T Fellner, J Wilde, U Wallrabe
Journal of Micromechanics and Microengineering 18 (6), 065008, 2008
5182008
Applying Anand model to represent the viscoplastic deformation behavior of solder alloys
GZ Wang, ZN Cheng, K Becker, J Wilde
J. Electron. Packag. 123 (3), 247-253, 2001
4042001
Rate dependent constitutive relations based on Anand model for 92.5 Pb5Sn2. 5Ag solder
J Wilde, K Becker, M Thoben, W Blum, T Jupitz, G Wang, ZN Cheng
IEEE transactions on Advanced Packaging 23 (3), 408-414, 2000
1572000
Viscoplastic Anand model for solder alloys and its application
ZN Cheng, GZ Wang, L Chen, J Wilde, K Becker
Soldering & Surface Mount Technology 12 (2), 31-36, 2000
1532000
Failure mechanisms of sintered silver interconnections for power electronic applications
T Herboth, M Guenther, A Fix, J Wilde
2013 IEEE 63rd electronic components and technology conference, 1621-1627, 2013
952013
Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue
AR Fix, W Nüchter, J Wilde
Soldering & Surface Mount Technology 20 (1), 13-21, 2008
882008
Microstructural and electrical properties of different-sized aluminum-alloyed contacts and their layer system on silicon surfaces
J Krause, R Woehl, M Rauer, C Schmiga, J Wilde, D Biro
Solar Energy Materials and Solar Cells 95 (8), 2151-2160, 2011
822011
A temperature-gradient-induced failure mechanism in metallization under fast thermal cycling
T Smorodin, J Wilde, P Alpern, M Stecher
IEEE Transactions on device and materials reliability 8 (3), 590-599, 2008
772008
Moisture-resistant properties of SiNx films prepared by PECVD
H Lin, L Xu, X Chen, X Wang, M Sheng, F Stubhan, KH Merkel, J Wilde
Thin Solid Films 333 (1-2), 71-76, 1998
731998
Assembly and packaging technologies for high-temperature and high-power GaN devices
AA Bajwa, Y Qin, R Reiner, R Quay, J Wilde
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015
652015
Capacitive strain gauges on flexible polymer substrates for wireless, intelligent systems
R Zeiser, T Fellner, J Wilde
Journal of Sensors and Sensor Systems 3 (1), 77-86, 2014
482014
Impact of screen printing silver paste components on the space charge region recombination losses of industrial silicon solar cells
R Hoenig, A Kalio, J Sigwarth, F Clement, M Glatthaar, J Wilde, D Biro
Solar Energy Materials and Solar Cells 106, 7-10, 2012
482012
The nature of screen printed front side silver contacts-results of the project MikroSol
R Hoenig, M Duerrschnabel, W van Mierlo, Z Aabdin, J Bernhard, ...
Energy Procedia 43, 27-36, 2013
442013
New measurement method for the investigation of space charge region recombination losses induced by the metallization of silicon solar cells
R Hoenig, M Glatthaar, F Clement, J Greulich, J Wilde, D Biro
Energy Procedia 8, 694-699, 2011
412011
Development, characterisation and 1000 suns outdoor tests of GaAs monolithic interconnected module (MIM) receivers
R Loeckenhoff, F Dimroth, E Oliva, A Ohm, J Wilde, D Faiman, S Biryukov, ...
Progress in Photovoltaics: Research and applications 16 (2), 101-112, 2008
402008
Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices
AA Bajwa, J Wilde
Microelectronics Reliability 60, 116-125, 2016
392016
Development of lead-free silver ink for front contact metallization
A Kalio, M Leibinger, A Filipovic, K Krüger, M Glatthaar, J Wilde
Solar energy materials and solar cells 106, 51-54, 2012
392012
Assessment of thermo-mechanical stresses in low temperature joining technology
T Herboth, C Früh, M Günther, J Wilde
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012
392012
Design optimization of an eddy current sensor using the finite-elements method
J Wilde, Y Lai
Microelectronics Reliability 43 (3), 345-349, 2003
342003
The influence of package-induced stresses on moulded Hall sensors
S Fischer, H Beyer, R Janke, J Wilde
Microsystem technologies 12, 69-74, 2005
322005
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