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Yen-Tien Lu
Yen-Tien Lu
Tokyo Electron, Intel, Rice University, Academia sinica
Bestätigte E-Mail-Adresse bei us.tel.com - Startseite
Titel
Zitiert von
Zitiert von
Jahr
Fabrication and characteristics of black silicon for solar cell applications: An overview
CH Hsu, JR Wu, YT Lu, DJ Flood, AR Barron, LC Chen
Materials Science in Semiconductor Processing 25, 2-17, 2014
1232014
Surface modification of highly ordered TiO2 nanotube arrays for efficient photoelectrocatalytic water splitting
CJ Lin, YT Lu, CH Hsieh, SH Chien
Applied Physics Letters 94 (11), 113102, 2009
972009
Fabrication of open-ended high aspect-ratio anodic TiO2 nanotube films for photocatalytic and photoelectrocatalytic applications
CJ Lin, WY Yu, YT Lu, SH Chien
Chemical Communications, 6031-6033, 2008
892008
Anti-reflection layers fabricated by a one-step copper-assisted chemical etching with inverted pyramidal structures intermediate between texturing and nanopore-type black silicon
YT Lu, AR Barron
Journal of Materials Chemistry A 2 (30), 12043-12052, 2014
772014
Nanopore-type black silicon anti-reflection layers fabricated by a one-step silver-assisted chemical etching
YT Lu, AR Barron
Phys. Chem. Chem. Phys. 15, 9862-9870, 2013
652013
Materials Science in Semiconductor Processing
J Lu, Z Ye, L Wang, J Huang, B Zhao
102003
Low-k dielectric etch challenges at the 7 nm logic node and beyond: Continuous-wave versus quasiatomic layer plasma etching performance review
KM Lutker-Lee, YT Lu, Q Lou, J Kaminsky, Y Kikuchi, A Raley
Journal of Vacuum Science & Technology A 37 (1), 2019
82019
In-Situ Fabrication of a Self-Aligned Selective Emitter Silicon Solar Cell Using the Gold Top Contacts To Facilitate the Synthesis of a Nanostructured Black Silicon …
YT Lu, AR Barron
ACS Applied Materials & Interfaces 7 (22), 11802-11814, 2015
52015
High aspect ratio via etch using atomic layer deposition protection layer
YT Lu, X Sun, ECF Liu
US Patent 11,121,027, 2021
42021
Atomic layer deposition for low-K trench protection during etch
YT Lu, D O'meara, A Raley, X Sun
US Patent 10,964,587, 2021
32021
Fabrication of anti-reflection coating layers for silicon solar cells by liquid phase deposition
YT Lu, AR Barron
Main Group Chemistry 14 (4), 279-290, 2015
22015
Selective deposition of conductive cap for fully-aligned-via (FAV)
YT Lu, KH Yu, X Sun, A Raley
US Patent 11,515,203, 2022
12022
Method for patterning a dielectric layer
YT Lu, X Sun, S Chang, ECF Liu, A Raley, K Lutker-Lee
US Patent 11,756,790, 2023
2023
ALD (atomic layer deposition) liner for via profile control and related applications
X Sun, YT Lu, A Raley, D O'meara, J Smith
US Patent 11,742,241, 2023
2023
Split ash processes for via formation to suppress damage to low-K layers
YT Lu, A Raley, J Lee
US Patent 11,721,578, 2023
2023
Method for using ultra thin ruthenium metal hard mask for etching profile control
YT Lu, KH Yu, A Raley
US Patent 11,688,604, 2023
2023
Radiation of substrates during processing and systems thereof
M Edley, X Sun, YT Lu, A Raley, H Zhang, H Suzuki, S Hu
US Patent 11,289,325, 2022
2022
ALD (atomic layer deposition) liner for via profile control and related applications
X Sun, YT Lu, A Raley, D O'meara, J Smith
US Patent 11,164,781, 2021
2021
Dielectric etch stop layer for reactive ion etch (rie) lag reduction and chamfer corner protection
YT Lu, X Sun, M Edley, A Raley
US Patent App. 17/179,117, 2021
2021
Metal hard mask layers for processing of microelectronic workpieces
YT Lu, KH Yu, A Metz
US Patent 10,950,444, 2021
2021
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