| Localized induction heating solder bonding for wafer level MEMS packaging HA Yang, M Wu, W Fang Journal of Micromechanics and Microengineering 15 (2), 394, 2004 | 157 | 2004 |
| Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration CW Lin, CP Hsu, HA Yang, WC Wang, W Fang Journal of Micromechanics and Microengineering 18 (2), 025018, 2008 | 64 | 2008 |
| Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections CW Lin, HA Yang, WC Wang, W Fang Journal of micromechanics and microengineering 17 (6), 1200, 2007 | 58 | 2007 |
| Hemispherical wineglass resonators fabricated from the microcrystalline diamond A Heidari, ML Chan, HA Yang, G Jaramillo, P Taheri-Tehrani, P Fonda, ... Journal of Micromechanics and Microengineering 23 (12), 125016, 2013 | 56 | 2013 |
| High quality factor nanocrystalline diamond micromechanical resonators limited by thermoelastic damping H Najar, ML Chan, HA Yang, L Lin, DG Cahill, DA Horsley Applied Physics Letters 104 (15), 2014 | 45 | 2014 |
| Micromachined polycrystalline diamond hemispherical shell resonators A Heidari, ML Chan, HA Yang, G Jaramillo, P Taheri-Tehrani, P Fonda, ... 2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013 | 39 | 2013 |
| Micro-electro-mechanical-system package and method for manufacturing the same HA Yang, MJ Wang, WC Wang, MC Lee, WP Huang, FC Cheng US Patent 7,706,149, 2010 | 34 | 2010 |
| Improvement of bonding time and quality of anodic bonding using the spiral arrangement of multiple point electrodes JT Huang, HA Yang Sensors and Actuators A: Physical 102 (1-2), 1-5, 2002 | 32 | 2002 |
| Silicon chip having through via and method for making the same HA Yang, PC Chen, CH Chen US Patent 8,263,493, 2012 | 30 | 2012 |
| A novel coilless scanning mirror using eddy current Lorentz force and magnetostatic force HA Yang, TL Tang, ST Lee, W Fang Journal of microelectromechanical systems 16 (3), 511-520, 2007 | 30 | 2007 |
| Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates HA Yang US Patent 8,836,116, 2014 | 28 | 2014 |
| Bond ring for a first and second substrate CW Cheng, HA Yang US Patent 8,810,027, 2014 | 27 | 2014 |
| MEMS device etch stop CH Chu, YH Tsai, KC Liang, SHU Chia-Pao, LC Chu, K Chang, HA Yang, ... US Patent 8,368,152, 2013 | 27 | 2013 |
| Method for manufacturing electric connections in wafer HA Yang US Patent 7,681,779, 2010 | 27 | 2010 |
| Excimer laser-induced formation of metallic microstructures by electroless copper plating H Yang, CT Pan Journal of micromechanics and microengineering 12 (2), 157, 2002 | 27 | 2002 |
| On the selective magnetic induction heating of micron scale structures HA Yang, CW Lin, CY Peng, W Fang Journal of Micromechanics and Microengineering 16 (7), 1314, 2006 | 20 | 2006 |
| Wafer level self-assembly of microstructures using global magnetic lifting and localized induction welding HA Yang, CW Lin, W Fang Journal of Micromechanics and Microengineering 16 (1), 27, 2005 | 16 | 2005 |
| Microelectromechanical microphone packaging system WC Wang, SM Wu, HA Yang, KP Yang, CC Lin US Patent 7,945,062, 2011 | 11 | 2011 |
| Method of forming a bond ring for a first and second substrate CW Cheng, HA Yang US Patent 9,056,766, 2015 | 9 | 2015 |
| Analysis of high performance RF integrated passive circuits using the glass substrate CC Wang, HA Yang, YC Shyu, MH Li, CT Chiu, SM Wu, CW Kuo, ... 2008 IEEE 9th VLSI Packaging Workshop of Japan, 135-138, 2008 | 9 | 2008 |
