| Lattice strain and defects analysis in nanostructured semiconductor materials and devices by high‐resolution X‐ray diffraction: theoretical and practical aspects S Dolabella, A Borzì, A Dommann, A Neels Small Methods 6 (2), 2100932, 2022 | 81 | 2022 |
| Microstructure analysis of epitaxial BaTiO3 thin films on SrTiO3-buffered Si: Strain and dislocation density quantification using HRXRD methods A Borzì, S Dolabella, W Szmyt, J Geler-Kremer, S Abel, J Fompeyrine, ... Materialia 14, 100953, 2020 | 18 | 2020 |
| Real-and Q-space travelling: multi-dimensional distribution maps of crystal-lattice strain (∊ 044) and tilt of suspended monolithic silicon nanowire structures S Dolabella, R Frison, GA Chahine, C Richter, TU Schulli, Z Tasdemir, ... Journal of applied crystallography 53 (1), 58-68, 2020 | 11 | 2020 |
| A holistic X-ray analytical approach to support sensor design and fabrication: Strain and cracking analysis for wafer bonding processes A Borzì, R Zboray, S Dolabella, JF Le Neal, P Drljaca, G Fiorucci, ... Materials & Design 210, 110052, 2021 | 6 | 2021 |
| Dual pulsed laser deposition system for the growth of complex materials and heterostructures P Orgiani, SK Chaluvadi, SP Chalil, F Mazzola, A Jana, S Dolabella, ... Review of Scientific Instruments 94 (3), 2023 | 5 | 2023 |
| Robust Barium Phosphonate Metal–Organic Frameworks Synthesized under Aqueous Conditions KA Salmeia, S Dolabella, D Parida, TJ Frankcombe, AT Afaneh, ... ACS Materials Letters 3 (7), 1010-1015, 2021 | 4 | 2021 |
| HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors A Borzi, R Zboray, S Dolabella, S Brun, F Telmont, P Kupferschmied, ... Applied Materials Today 29, 101555, 2022 | 3 | 2022 |
| Nd: YAG infrared laser as a viable alternative to excimer laser: YBCO case study SK Chaluvadi, S Punathum Chalil, F Mazzola, S Dolabella, P Rajak, ... Scientific Reports 13 (1), 3882, 2023 | 1 | 2023 |
| Correlated disorder by defects clusters in LiNbO3 single crystals after crystal ion-slicing S Dolabella, A Reinhardt, A Bartasyte, S Margueron, A Sharma, X Maeder, ... Materials & Design 231, 112001, 2023 | | 2023 |
| The Role of Strain in Proton Conduction in Multi-Oriented BaZr0.9Y0.1O3−δ Thin Film MS Saleem, Q Chen, NA Shepelin, S Dolabella, MD Rossell, X Zhang, ... ACS Applied Materials & Interfaces 14 (50), 55915-55924, 2022 | | 2022 |
| HRXRD and micro-CT investigation of stress and defects induced by a novel packaging design for MEMS sensors A Borzì, R Zboray, S Dolabella, S Brun, F Telmont, P Kupferschmied, ... Acta Crystallographica Section A: Foundations and Advances 78, a237-a238, 2022 | | 2022 |
| Determination of stress, cracks and defects density in crystals after wafer-bonding processes: a novel HRXRD–X-ray micro-CT conjoint analytical approach A Borzì, R Zboray, S Dolabella, A Dommann, A Neels Acta Crystallographica Section A: Foundations and Advances 77, C619-C619, 2021 | | 2021 |
| DIRECT AND FOURIER SPACE TRAVELING: MULTI-DIMENSIONAL MAPPING OF LATTICE STRAIN AND TILT OF A SUSPENDED SILICON NANOWIRE IN A MONOLITHIC SYSTEM S Dolabella ACTA CRYSTALLOGRAPHICA A-FOUNDATION AND ADVANCES 75, E705-E705, 2019 | | 2019 |
| 1Center for X-ray Analytics, Empa-Dübendorf (Switzerland), 2Sy&Se SA-La Chaux-de-Fonds (Switzerland), 3TE Connectivity-Bevaix (Switzerland), 4eHaute Ecole Arc Ingénierie-La … A Borzì, R Zboray, S Dolabella, S Brun, F Telmont, P Kupferschmied, ... Foundations of Crystallography, 0 | | |
