| Modeling and analysis of phase change materials for efficient thermal management F Kaplan, C De Vivero, S Howes, M Arora, H Homayoun, W Burleson, ... 2014 IEEE 32nd International Conference on Computer Design (ICCD), 256-263, 2014 | 28 | 2014 |
| Optimizing communication and cooling costs in HPC data centers via intelligent job allocation F Kaplan, J Meng, AK Coskun 2013 International Green Computing Conference Proceedings, 1-10, 2013 | 23 | 2013 |
| Simulation and optimization of HPC job allocation for jointly reducing communication and cooling costs J Meng, S McCauley, F Kaplan, VJ Leung, AK Coskun Sustainable Computing: Informatics and Systems 6, 48-57, 2015 | 22 | 2015 |
| Unveiling the interplay between global link arrangements and network management algorithms on dragonfly networks F Kaplan, O Tuncer, VJ Leung, SK Hemmert, AK Coskun 2017 17th IEEE/ACM International Symposium on Cluster, Cloud and Grid …, 2017 | 13 | 2017 |
| Locool: Fighting hot spots locally for improving system energy efficiency F Kaplan, M Said, S Reda, AK Coskun IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019 | 11 | 2019 |
| Level-spread: A new job allocation policy for dragonfly networks Y Zhang, O Tuncer, F Kaplan, K Olcoz, VJ Leung, AK Coskun 2018 IEEE International Parallel and Distributed Processing Symposium (IPDPS …, 2018 | 11 | 2018 |
| Communication and cooling aware job allocation in data centers for communication-intensive workloads J Meng, E Llamosí, F Kaplan, C Zhang, J Sheng, M Herbordt, G Schirner, ... Journal of Parallel and Distributed Computing 96, 181-193, 2016 | 11 | 2016 |
| Predictive management of heterogeneous processing systems F Kaplan, M Arora, I Paul, WP Burleson US Patent App. 14/488,874, 2016 | 9 | 2016 |
| Fast thermal modeling of liquid, thermoelectric, and hybrid cooling F Kaplan, S Reda, AK Coskun 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 8 | 2017 |
| Control of thermal energy transfer for phase change material in data center F Kaplan, M Arora, WP Burleson, I Paul, Y Eckert US Patent App. 14/709,655, 2016 | 6 | 2016 |
| Adaptive sprinting: How to get the most out of Phase Change based passive cooling F Kaplan, AK Coskun 2015 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2015 | 5 | 2015 |
| Design optimization of 3D multi-processor system-on-chip with integrated flow cell arrays A Andreev, F Kaplan, M Zapater, AK Coskun, D Atienza Proceedings of the International Symposium on Low Power Electronics and …, 2018 | 3 | 2018 |
| Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed C De Vivero, F Kaplan, AK Coskun International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 3 | 2015 |
| Topology-aware reliability optimization for multiprocessor systems J Meng, F Kaplan, M Hsieh, AK Coskun 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip …, 2012 | 3 | 2012 |
| 10 Thermal Modeling and Management for 3D Stacked Systems T Zhang, F Kaplan, AK Coskun | 2 | 2016 |
| 10 Thermal Modeling T Zhang, F Kaplan, AK Coskun Physical Design for 3D Integrated Circuits, 229, 2017 | | 2017 |
| Improving processor efficiency through thermal modeling and runtime management of hybrid cooling strategies F Kaplan Boston University, 2017 | | 2017 |
