| Thermal modeling of multi-fin field effect transistor structure using proper orthogonal decomposition W Jia, BT Helenbrook, MC Cheng IEEE Transactions on Electron Devices 61 (8), 2752-2759, 2014 | 34 | 2014 |
| Fast thermal simulation of FinFET circuits based on a multiblock reduced-order model W Jia, BT Helenbrook, MC Cheng IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015 | 31 | 2015 |
| An effective thermal model for FinFET structure MC Cheng, JA Smith, W Jia, R Coleman IEEE Transactions on Electron Devices 61 (1), 202-206, 2013 | 29 | 2013 |
| A methodology for thermal simulation of interconnects enabled by model reduction with material property variation W Jia, MC Cheng Journal of Computational Science 61, 101665, 2022 | 9 | 2022 |
| Thermal modeling for FinFET NAND gate circuits using a multi-block reduced-order model MC Cheng, W Jia, BT Helenbrook 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 7 | 2015 |
| Thermal modeling of multi-gate field effect transistors based on a reduced order model W Jia, BT Helenbrook, MC Cheng 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 7 | 2014 |
| Modeling of photovoltaic cells and arrays based on singular value decomposition K Zhang, W Jia, J Koplowitz, P Marzocca, MC Cheng Semiconductor science and technology 28 (3), 035002, 2013 | 7 | 2013 |
| A reduced order thermal model with application to multi-fin field effect transistor structure W Jia, BT Helenbrook, MC Cheng Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 5 | 2014 |
| POD-based thermal model for FinFET IC structure MC Cheng, W Jia, BT Helenbrook 2014 12th IEEE International Conference on Solid-State and Integrated …, 2014 | 4 | 2014 |
| A physics-based compact thermal model for multi-gate field effect transistor structures JA Smith, W Jia, MC Cheng Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 3 | 2014 |
| POD based reduced basis element method for use in thermal modeling of integrated circuits DS Meyer, BT Helenbrook, W Jia, MC Cheng Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 2 | 2014 |
| A methodology for hierarchical thermal simulation of ICs from gate-level to architecture design MC Cheng, W Jia 2017 6th International Symposium on Next Generation Electronics (ISNE), 1-4, 2017 | 1 | 2017 |
| Multi-Element Thermal Modeling of Interconnects Derived from a Projection-based Leaning Algorithm MC Cheng, W Jia 2021 International Conference on Simulation of Semiconductor Processes and …, 2021 | | 2021 |
| Thermal Modeling of FinFET Devices and Integrated Circuits Based on Proper Orthogonal Decomposition W Jia Clarkson University, 2020 | | 2020 |
| Block-Based Compact Thermal Model for Microelectronic Circuits W Jia, MC Cheng GRADUATE RESEARCH SYMPOSIUM 2011 ABSTRACT BOOK, 18, 0 | | |
