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Wangkun Jia
Wangkun Jia
Bestätigte E-Mail-Adresse bei clarkson.edu
Titel
Zitiert von
Zitiert von
Jahr
Thermal modeling of multi-fin field effect transistor structure using proper orthogonal decomposition
W Jia, BT Helenbrook, MC Cheng
IEEE Transactions on Electron Devices 61 (8), 2752-2759, 2014
292014
An effective thermal model for FinFET structure
MC Cheng, JA Smith, W Jia, R Coleman
IEEE Transactions on Electron Devices 61 (1), 202-206, 2013
282013
Fast thermal simulation of FinFET circuits based on a multiblock reduced-order model
W Jia, BT Helenbrook, MC Cheng
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015
262015
A methodology for thermal simulation of interconnects enabled by model reduction with material property variation
W Jia, MC Cheng
Journal of Computational Science 61, 101665, 2022
72022
Thermal modeling of multi-gate field effect transistors based on a reduced order model
W Jia, BT Helenbrook, MC Cheng
2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014
72014
Modeling of photovoltaic cells and arrays based on singular value decomposition
K Zhang, W Jia, J Koplowitz, P Marzocca, MC Cheng
Semiconductor science and technology 28 (3), 035002, 2013
72013
A reduced order thermal model with application to multi-fin field effect transistor structure
W Jia, BT Helenbrook, MC Cheng
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
52014
Thermal modeling for FinFET NAND gate circuits using a multi-block reduced-order model
MC Cheng, W Jia, BT Helenbrook
2015 21st International Workshop on Thermal Investigations of ICs and …, 2015
42015
POD-based thermal model for FinFET IC structure
MC Cheng, W Jia, BT Helenbrook
2014 12th IEEE International Conference on Solid-State and Integrated …, 2014
42014
A physics-based compact thermal model for multi-gate field effect transistor structures
JA Smith, W Jia, MC Cheng
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
32014
POD based reduced basis element method for use in thermal modeling of integrated circuits
DS Meyer, BT Helenbrook, W Jia, MC Cheng
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
22014
A methodology for hierarchical thermal simulation of ICs from gate-level to architecture design
MC Cheng, W Jia
2017 6th International Symposium on Next Generation Electronics (ISNE), 1-4, 2017
12017
Multi-Element Thermal Modeling of Interconnects Derived from a Projection-based Leaning Algorithm
MC Cheng, W Jia
2021 International Conference on Simulation of Semiconductor Processes and …, 2021
2021
Thermal Modeling of FinFET Devices and Integrated Circuits Based on Proper Orthogonal Decomposition
W Jia
Clarkson University, 2020
2020
Block-Based Compact Thermal Model for Microelectronic Circuits
W Jia, MC Cheng
GRADUATE RESEARCH SYMPOSIUM 2011 ABSTRACT BOOK, 18, 0
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