| Interconnect design tradeoffs for silicon and glass interposers H Kalargaris, VF Pavlidis New Circuits and Systems Conference (NEWCAS), 2014 IEEE 12th International …, 2014 | 16 | 2014 |
| STA compatible backend design flow for TSV-based 3-D ICs H Kalargaris, YC Chen, VF Pavlidis 2017 18th International Symposium on Quality Electronic Design (ISQED), 186-190, 2017 | 6 | 2017 |
| Computationally efficient standard-cell FEM-based thermal analysis VFP Yi-Chung Chen, Scott Ladenheim, Harry Kalargaris, Milan Mihajlović 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 490-495, 2017 | 4 | 2017 |
| Voltage scaling for 3-D ICs: When, how, and how much? H Kalargaris, VF Pavlidis Microelectronics journal 69, 35-44, 2017 | 3 | 2017 |
| Advanced circuit interface for systems with multiple voltage domains H Kalargaris, J Goodacre, VF Pavlidis 2016 12th Conference on Ph. D. Research in Microelectronics and Electronics …, 2016 | 1 | 2016 |
